NewsSTMicroelectronics brings Tower Semiconductor on board 300mm analog and power fab under...

STMicroelectronics brings Tower Semiconductor on board 300mm analog and power fab under construction in Italy

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Partners to accelerate ST Agrate R3 300mm fab ramp-up to large volumes

STMicroelectronics (NYSE:STM), a global semiconductor leader offering consumers across the spectrum of electronic devices applications and Tower Semiconductor (NASDAQ: TSEM & TASE: TSEM), the leading shop of high-value analog semiconductor services, introduced today a contract through which ST will certainly welcome Tower to its Agrate R3 300mm fab unfinished on its Agrate Brianza site in Italy. ST as well as Tower will certainly sign up with pressures for an increased fab ramp-up, a crucial element to reach a high utilization degree and also as a result a competitive wafer expense. ST will share the cleanroom in R3, with Tower mounting its own devices in one third of the complete space. The fab is expected to be prepared for equipment installment later on this year and begin production in the 2nd fifty percent of 2022.

ST and also Tower will share the clean area space and also the facility infrastructure. Both business will certainly buy their corresponding process tools as well as work together on the velocity of the great qualification and succeeding ramp-up. Operations will remain to be handled by ST, with select Tower workers seconded to ST in particular functions to sustain fab credentials as well as quantity ramp-up, as well as other design and also procedure roles. In the onset 130, 90 as well as 65nm procedures for clever power, analog mixed signal and RF processes will certainly be certified in R3. The items in these technologies will be especially utilized in auto, industrial and also individual electronic devices applications.

“The key parameter for industrial and economic performance of a fab is its utilization. With Tower we have a great partner for analog, power and mixed-signal volume manufacturing that will enable us to qualify and ramp up the Agrate R3 300mm fab significantly faster. This will enable an optimal utilization of the fab almost right from the early stage of production. The capacity of the full build-out state of the fab could even be increased compared to the original capacity estimate of 2018, when we started the project”, said Jean-Marc Chery, President and CEO of STMicroelectronics. “The products manufactured in Agrate R3 will support the automotive, industrial and personal electronics markets. They will contribute to ease the supply tensions in a wide range of applications in the mid to longer term.”

Tower CEO, Russell Ellwanger commented, “We are very pleased to announce this partnership with STMicroelectronics.  ST is well known for its leading technology, operational excellence, and corporate integrity. We look forward to our mutual success. Tower’s strong execution in advanced 65nm, 300mm based analog RF, power platforms, displays and other technologies, will be significantly enhanced by this activity in Agrate; more than tripling Tower’s 300mm foundry capacity to well service our customers’ increasing demand within these fast-growing markets.”

To implement this project, Tower will establish a wholly-owned Italian subsidiary. Tower will provide details on its significant cap-ex investment schedule and amounts invested as the project progresses.

Michal Pukala
Electronics and Telecommunications engineer with Electro-energetics Master degree graduation. Lightning designer experienced engineer. Currently working in IT industry.