NewsTexas Instruments to begin construction next year on new 300-mm semiconductor wafer...

Texas Instruments to begin construction next year on new 300-mm semiconductor wafer fabrication plants

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Texas Instruments Incorporated, (Nasdaq : TXN), today announced plans for next year’s construction of its 300-millimeter semiconductor wafer fabrication facilities (or “fabs”) at Sherman, Texas. There is potential for four fabs at the North Texas site to meet the demand. This is because semiconductor growth, especially in the automotive and industrial markets, will continue long into the future. The construction of the first and second factories is expected to start in 2022.

“TI’s future analog and embedded processing 300-mm fabs at the Sherman site are part of our long-term capacity planning to continue to strengthen our manufacturing and technology competitive advantage and support our customers’ demand in the coming decades,” said Rich Templeton, TI’s chairman, president and CEO. “Our commitment to North Texas spans more than 90 years, and this decision is a testament to our strong partnership and investment in the Sherman community.”

The first new fab could be in production by 2025. The site has the potential to be expanded to include four additional fabs. This could increase the investment potential to $30 billion, and provide direct employment for 3,000 people.

These new fabs will be added to TI’s 300-mm fabs. They include RFAB1 (both in Richardson Texas), DMOS6 in Dallas, Texas, and RFAB1 in Houston. Production is expected to begin in the second half 2022. TI also recently acquired LFAB (Lehi in Utah) and expects to start production in the first half of 2023.

Michal Pukala
Electronics and Telecommunications engineer with Electro-energetics Master degree graduation. Lightning designer experienced engineer. Currently working in IT industry.