The selection of heat-spreader materials is an important consideration for cooling modules in handheld electronic systems. Heat spreaders are typically used in close contact with the source of heat. This can be, for example, a subcomponent, chip, or microelectronic package. The heat spreader transfers and distributes heat from the source to a heat sink through a thermal interface material, or in some cases directly to air.
The Need for Heat Spreaders
The primary reason for using heat spreaders is to move the heat away from the source and avoid over-heating the electronic components. Localized high temperature centered around the source of heat, known as a hot spot, can be detrimental to the reliability and e