Lam Research Corp. (NASDAQ: LRCX) today announced Syndion(r) the GP, an innovative product that offers deep silicon etching capabilities to chipmakers working on next-generation power devices and integrated power management circuits that are used in the electric power, automotive, delivery, and energy industries.
As the technologies within these areas are becoming more advanced The need for more efficiency, higher power and higher density on the chip level grows which requires better cross-wafer uniformity to enable higher aspect ratio structures. This can be accomplished by advancing to a more advanced device’s structure, without losing the form factor. To achieve this device manufacturers require an extremely precise and homogenous deep silicon etch process.
Syndion GP is designed to facilitate this manufacturing process and is able to make devices using 200 millimeter and 300 millimeter wafer sizes, offering an easier route to increase capacity. Presently, many power devices are made from 200mm silicon wafers. However, to meet the demand for more devices production, the company is shifting to 300 mm-sized wafers.
Its Syndion GP solution is built on Lam’s world-class deep silicon etching capabilities and expands its collection of technology solutions for specialty applications. Specialty technologies refer to power devices, micro-electromechanical systems (MEMS), analog and mixed signal semiconductors, radio frequency IC (RF) solutions, optoelectronic devices, and CMOS image sensors (CIS) that support a broad range of consumer and industrial technologies and applications, such as electric vehicles, the internet of things and 5G.
“Demand for specialty devices continues to grow rapidly,” said Pat Lord, executive vice president of the Customer Support Business Group and Global Operations at Lam Research. “Through close collaboration with our customers, we identified the need for an accelerated path to manufacture advanced power devices using 300 mm wafers. Syndion GP can help chipmakers meet the growing demand, while supporting the continuous innovation of new specialty technology breakthroughs.” Syndion GP expands Lam’s extensive deep silicon etch product line that includes the proven 200 millimeter DSiE platform as well as the market-leading 300 mm Syndion GGS for hybrid memory, packaging and CMOS image sensors markets. Syndion GP offers the flexibility to meet both the high-precision control requirements and increased efficiency for large-scale manufacturing processes. It also demonstrates the wide range of deep silicon etching solutions needed to meet the challenges of the future generation of devices.
