Texas Instruments (TI) and iWave Systems have joined forces to introduce the iW-RainboW-G55M, a state-of-the-art Solderable System on Module (SoM) powered by TI AM62Ax Sitara processors. This innovative module follows the OSM v1.1 solderable SoM standard and offers an extensive range of interfaces in a compact form factor.
The concept of a Solderable SoM revolves around integrating crucial components, including processors, memory, connectivity interfaces, and power management, onto a single board. This solderable design ensures direct integration with larger circuit boards or carrier boards, streamlining system integration for developers.
By adopting the Solderable SoM approach, the development process becomes more efficient, eliminating the need for intricate circuitry design and assembly from scratch. The standardized interface simplifies connection to the mainboard, enabling developers to focus on their application-specific functionalities instead of dealing with underlying hardware complexities.
Solderable SoMs find wide-ranging applications in industries such as automotive, industrial automation, IoT, and embedded systems. They offer flexibility, scalability, and accelerated time-to-market for product development, all while ensuring dependable performance and long-term availability.
The iW-RainboW-G55M leverages the TI AM62Ax automotive-grade family of heterogeneous Arm®-based processors, featuring quad Arm Cortex®-A53 CPUs, a vision processing and deep learning accelerator, Arm Cortex-R5F CPUs for control and device management, display interfaces, extensive automotive peripherals, and networking options. This empowers the development of cutting-edge products and solutions that require seamless man-machine synergy at the edge.
iWave Systems has tailored the OSM standard to suit the TI AM62Ax SoM, providing users with a compact form factor, ruggedness (including vibration resistance), and technology scalability based on the specific processor and application requirements. This SoM enables customers to reduce risk and complexity, resulting in shorter time-to-market.
To cater to diverse memory requirements and interfaces for embedded applications, the TI AM62Ax SoM offers 2GB LPDDR4 (expandable up to 8GB), 16GB eMMC Flash (expandable up to 128GB), 16Mb QSPI Flash, and enhanced external memory access. The inclusion of an onboard Wi-Fi 6 + BT 5.3 + LR-WPAN module ensures versatile wireless connectivity, while a pair of CAN and Ethernet connectors with TSN compatibility enables deterministic networking options for industrial and automotive applications. Furthermore, the iW-RainboW-G55M OSM expands the RGB display interface and Camera peripheral, facilitating multimedia and AI capabilities at the edge.
Mr. Abdullah Khan M, Director of Engineering at iWave Systems, expressed the company’s commitment to enabling customer product development through an extensive portfolio of embedded computing platforms based on the TI AM62Ax processor series. The System on Module and Single Board Computers from iWave are specifically targeted at industrial, automation, and automotive applications. With a well-established product longevity program and manufacturing eco-system, iWave empowers customers to focus on their core competencies and reduce time-to-market.
Artem Aginskiy, General Manager of Processors at Texas Instruments, emphasized the user-friendly nature of TI vision processors like the AM62A family, which incorporate integrated AI accelerators, common software, and open-source machine learning frameworks and models. The new TI AM62Ax-based SoM from iWave further streamlines embedded designs, allowing engineers to expand the AI and vision processing capabilities of their automotive and industrial systems.
The AM62Ax OSM SoM is available on a carrier board as a Single Board Computer (SBC), doubling as an evaluation kit. This feature-rich multimedia insert-ready SBC comes in the compact Pico-ITX form factor, making it readily integrable across a diverse range of automotive and automation markets.
Both the System on Module and Single Board Computer are go-to-market and production-ready, complete with comprehensive documentation, software drivers, and a board support package.
With its built-in Hardware Security Module, advanced power management, AEC-Q104* compliance, compatibility with open-source operating systems, and a product longevity cycle of over 10 years, the iW-RainboW-G55M OSM stands as an ideal solution for competitive applications in the automotive sector, broad industrial applications, and automation markets.
As a globally recognized leader in the design and manufacturing of System on Modules and Single Board Computers, iWave Systems brings over 23 years of diverse experience in the embedded domain. With their reliable technology partnerships, iWave serves multiple domains worldwide, including industrial, medical, automotive, IoT, and computer vision, offering dependable and cutting-edge solutions.
Key features of iW-RainboW-G55M OSM SoM
- AM62Ax processor
- 4 x Cortex- A53 @ 1.4GHz
- 1 x Cortex-R5F @ 800MHz (MPU Channel with FFI)
- 1 x Cortex-R5F @ 800MHz (to support Device Management)
- C7xV-256 Deep Learning Accelerator (up to 2 TOPS)
- 2GB LPDDR4 RAM, 16GB eMMC Flash, 16Mb QSPI Flash
- Compliant with AEC-Q104 Global Standard
- IEEE 802.11 ac/ax, IEEE 802.15.4, and Bluetooth 5.3 Connectivity
- 2 x RGMII, 2 x USB 2.0, 1 x SD (4-bit)
- 1 x MIPI CSI, RGB 18-bit, I2S Audio x2
- 3 x UART, 1 x CAN, 2 x I2C, 1 x QSPI, 3 x GPIO, 2 x PWM
- MCU interfaces – 1 x MCAN, 1 x I2C, 1 x SPI, 2 x UART, 8 x GPIOs
- Size-LF Form Factor: 45 mm x 45 mm
- Solderable LGA Package in OSM v1.1 Standard
- 622 Contacts
- Linux & Free RTOS OS Support