FlightSense portfolio now comprises direct and indirect ToF products from single-point ranging all-in-one sensors to sophisticated high-resolution 3D imagers enabling future generations of intuitive, smart, and autonomous devices.”
Direct time of flight (iToF) sensors such as VD55H1 calculate the distance to objects reading the shift in phase between the reflection signal and the one that was emitted. This is a complement in direct time-of-flight (dToF) sensors which determine the duration for signals transmitted to reflect back onto the sensor. ST’s extensive portfolio of high-end technologies allows the Company to develop indirect and direct high-resolution sensors, and to provide optimal solutions that are specifically tailored to the needs of the application.
VD55H1’s unique pixel structure and fabrication process, which leverages internal the 40nm stacking wafer process that guarantees low power consumption, reduced noise and an optimized die area. Die contains 75 percent more pixels than other VGA sensors, but within the same size.
The VD55H1 sensor is accessible to prospective customers to try. The maturity of production in volume is expected to be achieved in the second quarter of 2022. A reference design as well as a complete software package are offered to assist in the speed of sensor evaluation and development of projects.
