Addressing Energy Demands in AI-Driven Global Data Generation
Artificial Intelligence (AI) is at the heart of the dramatic surge in the creation of global data, a phenomenon that in turn has vastly increased the energy requirements of the chips that support this data proliferation. In response to this growing demand, Infineon Technologies AG has announced the launch of its TDM2254xD series dual-phase power modules. These innovative modules deliver superior power density, quality, and total cost of ownership (TCO) for AI data centers.
Infineon’s TDM2254xD Series: A Blend of Innovation and Performance
The TDM2254xD series products are a harmonious merger of robust OptiMOS TM MOSFET technology, innovative packaging, and proprietary magnetic structuring. This combination gives birth to a product that offers industry-leading electrical and thermal performance, all wrapped in a robust mechanical design. The end result is a product that allows data centers to operate at higher efficiency levels, thereby satisfying the high power requirements of AI GPU (Graphic Processor Unit) platforms while significantly reducing TCO.
The Imperative for Energy-Efficient Power Solutions
Given that AI servers consume three times as much energy as traditional servers, and data centers already account for more than 2 percent of the global energy supply, it’s crucial to develop innovative power solutions and architecture designs that contribute to decarbonization. Infineon’s TDM2254xD dual-phase power modules, in synergy with XDP TM Controller technology, provide efficient voltage regulation for high-performance computing platforms. This results in superior electrical, thermal, and mechanical operation, thereby paving the way for a greener AI factory.
Unveiling at the Applied Power Electronics Conference
The TDM2254xD series was presented at the Applied Power Electronics Conference (APEC). The modules’ unique design facilitates efficient heat transfer from the power stage to the heat sink via an innovative inductor design optimized for current and heat transfer. This allows for a 2 percent higher efficiency than industry average modules at full load. By improving power efficiency at the core of a GPU, significant energy savings can be achieved at scale. This results in megawatts of energy saved for data centers running generative AI, leading to reduced CO2 emissions and millions of dollars in operating cost savings over the system’s lifetime.
Pushing the Boundaries of Performance and Quality
“Infineon’s unique Product-to-System solution, paired with our advanced manufacturing capabilities, allows us to deliver solutions with differentiated performance and quality at scale. This significantly reduces the total cost of ownership for our customers,” commented Athar Zaidi, Senior Vice President, Power & Sensor Systems at Infineon Technologies. Zaidi expressed his excitement about bringing this solution to market, as it promises to accelerate computing performance and further Infineon’s mission of digitalization and decarbonization.
