The electronics industry is rapidly evolving toward compact, high-efficiency systems to meet demands in AI, renewable energy, and electric mobility. Infineon Technologies AG has responded with two new product families in its CoolSiC™ MOSFET 650V G2 portfolio, housed in Q-DPAK and TOLL packages. These solutions leverage advanced top- and bottom-side cooling technologies to optimize power density, thermal performance, and cost efficiency for switched-mode power supplies (SMPS) and beyond.
CoolSiC™ MOSFETs 650V G2: A Technological Leap
Built on Generation 2 (G2) silicon carbide (SiC) technology, these MOSFETs deliver superior performance, reliability, and ease of integration. Key advancements include:
- Reduced R DS(on): TOLL variants offer 10–60 mΩ, while Q-DPAK models range from 7–20 mΩ, minimizing conduction losses.
- Dual Cooling Options: Top-side cooling (TSC) in Q-DPAK and bottom-side cooling in TOLL cater to diverse thermal management needs.
- Target Applications: AI servers, EV chargers, solid-state circuit breakers, humanoid robots, and renewable energy systems.
The TOLL package stands out for its Thermal Cycling on Board (TCoB) capability, reducing PCB footprint by up to 30% and cutting manufacturing costs in SMPS designs. Meanwhile, the Q-DPAK complements Infineon’s TSC family (including CoolMOS™ 8 and CoolGaN™), enabling 95% direct heat dissipation and dual-sided PCB utilization to mitigate parasitic effects.
Top- and Bottom-Side Cooling Explained
Top-Side Cooling (TSC)
- Mechanism: Heat dissipates directly from the exposed drain at the package’s surface to a heatsink, bypassing the PCB.
- Benefits:
- 95% Heat Dissipation: Reduces thermal resistance (RthJA) by 20% compared to TOLL.
- Space Efficiency: Enables dual-sided PCB use, boosting power density by 2x.
- Applications: High-power systems like e-scooters, battery management, and industrial motor drives.
Bottom-Side Cooling
- Mechanism: Heat transfers through the PCB to a heatsink, ideal for convection-cooled systems.
- Benefits:
- Compact Design: TOLL’s 8×8 mm Thin-TOLL variant minimizes PCB area in microinverters and 5G power supplies.
- Cost-Effective: Lowers system-level cooling costs by simplifying thermal management
The Critical Role of Switched-Mode Power Supplies (SMPS)
SMPS are pivotal in converting electrical power efficiently across industries. Infineon’s CoolSiC™ MOSFETs enhance SMPS by:
- Boosting Power Density: Thin-TOLL and TOLT packages reduce daughter card thickness, enabling flat heat sinks in server PSUs.
- Improving Efficiency: SiC technology cuts switching losses, critical for high-frequency operations in EV chargers and AI data centers.
- Enabling Sustainability: Supports renewable energy systems by maximizing efficiency in solar inverters and grid storage.
Technical Specifications and Availability
- TOLL Package: R DS(on) 10–60 mΩ, ideal for medium-power SMPS.
- Q-DPAK Package: R DS(on) 7–20 mΩ, tailored for high-power applications.
- TOLT Variants: Include a 15 mΩ option, bridging the gap between TOLL and Q-DPAK.
Both packages are now available, with expanded R DS(on) options expected by late 2025.
Market Impact and Future Outlook
Infineon’s TSC packages, including Q-DPAK and TOLT, were standardized by JEDEC in 2023, ensuring pin-to-pin compatibility and accelerating adoption in automotive and industrial sectors. This standardization reduces BOM costs by 15–20% and simplifies cooling system designs.
The company’s focus on system-level innovation aligns with global decarbonization goals, positioning CoolSiC™ MOSFETs as a cornerstone for next-gen power electronics.
Infineon’s CoolSiC™ MOSFET 650V G2 series exemplifies the synergy between cutting-edge semiconductor technology and thermal management advancements. By addressing the dual challenges of power density and heat dissipation, these solutions empower industries to achieve greener, more efficient systems. As SMPS evolve to meet AI and electrification demands, Infineon’s innovations will likely set new benchmarks for performance and sustainability.
