Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has expanded its 650 V CoolMOS™ CFD7A portfolio, introducing the QDPAK package. This development marks a significant advancement in charging systems for electric vehicles, focusing on cost-efficiency and high performance. The QDPAK package is engineered to offer superior thermal capabilities and enhanced electrical performance compared to TO247 THD devices, thereby facilitating more efficient energy utilization in onboard chargers and DC-DC converters.
Enhancing Electric Vehicle Charging Efficiency and Power
The latest addition to the CoolMOS CFD7A series brings forth efficient and powerful charging systems that are key to reducing charging times and vehicle weight. This contributes to increased design flexibility and a reduction in the total cost of ownership of electric vehicles. The QDPAK TSC (top side cooled) variant enables designers to achieve higher power densities and optimal PCB space utilization.
Key Features of the 650 V CoolMOS CFD7A
With reduced parasitic source inductance, the 650 V CoolMOS CFD7A minimizes electromagnetic interference (EMI), ensuring clear signals and consistent performance. The inclusion of a Kelvin source pin enhances precision in current sensing, crucial for accurate measurements in demanding conditions. This device also boasts a suitable creepage distance for high-voltage applications, high current capability, and a high power dissipation (P tot) of up to 694 W at 25°C, making it versatile for a range of applications.
Advancements in System Design and Thermal Management
New system designs utilizing the 650 V CoolMOS CFD7A in the QDPAK TSC package will significantly improve PCB space usage, double power density, and enhance thermal management through substrate thermal decoupling. This innovation simplifies assembly, eliminates the need for board stacking, and reduces connector requirements, effectively lowering system costs. The power switch’s reduced thermal resistance, by up to 35 percent, offers high power dissipation that surpasses standard cooling solutions.
Addressing Thermal Limitations and Boosting System Performance
The QDPAK package overcomes thermal limitations commonly encountered in bottom side cooled SMD designs using FR4 PCBs, thereby enhancing system performance. An optimized power loop design, positioning drivers near the power switch, improves reliability by minimizing stray inductance and chip temperatures.
Standardization and Future Developments
Recognized as a JEDEC standard for high-power applications since February 2023, the QDPAK TSC package is set to become widely adopted in new designs with a standardized package design and footprint. Infineon plans to release additional Automotive Qualified devices in QDPAK TSC for onboard chargers and DC-DC converters in 2024, including 750 V and 1200 V CoolSiC™ devices.
Product Availability
The 650 V CoolMOS CFD7A is currently available in the QDPAK package, with both top-side cooled (TSC) and bottom-side cooled (BSC) versions. This launch represents a pivotal step in the evolution of electric vehicle charging systems, offering a robust, cost-effective, and efficient solution for modern power needs.
What is CoolMOS
“CoolMOS” is a technology developed by Infineon Technologies AG, a leading semiconductor manufacturer. It refers to a family of high-performance Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs) that are known for their high efficiency and power density. These MOSFETs are designed to handle high voltages and currents, which makes them suitable for a variety of power applications, including power supply units, lighting, battery management, and electric vehicle charging systems.
The key features of CoolMOS technology include:
- Low On-Resistance (Rds(on)): This feature reduces conduction losses when the transistor is in the ‘on’ state, allowing higher currents to flow with less power loss.
- Fast Switching Speed: CoolMOS transistors can switch on and off very quickly, which is beneficial for applications where high-frequency operation is required, such as in switch-mode power supplies.
- High Breakdown Voltage: They are capable of handling high voltages, making them suitable for applications that require high voltage operations.
- Reduced Energy Loss: The technology is engineered to minimize energy loss during the switching process and in the ‘on’ state, enhancing overall efficiency.
- Compact Design: The high power density allows for smaller component sizes, which is advantageous in applications where space is limited.
- Thermal Performance: They are designed to have good thermal characteristics, helping in managing heat dissipation efficiently.
CoolMOS technology is part of Infineon’s broader portfolio of power semiconductor products and is continually evolving to meet the demands of modern electronic and electrical applications, particularly where energy efficiency and high power handling are crucial.
