Infineon Technologies AG (FSE: IFX/OTCQX IFNNY) introduces the automotive-certified EasyPACK 2B EDT2, which is a versatile and flexible half bridge power unit. Based on the inverter’s conditions the 750 V unit can deliver an output power of 50 kW and 300 A rms. With its specifications this module is designed for use used in electric and hybrid automobiles.
In the last 10 decades, Infineon has sold more than 50 million EasyPACK modules that include different chipsets that can be used in a broad array of automotive and industrial applications. With the introduction of EDT2 (Electric Drive Train) technology that is included in this module and the full automotive certification, Infineon is now expanding the range of applications for the family of modules to include inverters for traction. The most important feature of EDT2 technology is its higher efficiency in low load conditions. The EDT2 chip has significantly lower losses than the current products that are available, and beats the previous generation of Infineon’s chips by 20 %.
A different feature of EasyPACK is the plug-and-play method that makes it easier to integrate modules. Additionally, when compared to conventional discrete through-hole packaging and the hybridPACK Soldering on the connections is not more required. Its PressFIT contact technology permits an improvement in the time required to mount. Because of the size of the package 3 EasyPACK 2Bs need 30 percent less surface than the HybridPACK 1. Because of this, they are not only a small size but also an affordable design. In addition, the EasyPACK2B EDT2 is fully certified in accordance with the AQG324 standard.
