NewsToposens introduces new ultrasonic 3D sensor featuring Infineon’s XENSIV MEMS microphone

Toposens introduces new ultrasonic 3D sensor featuring Infineon’s XENSIV MEMS microphone

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Toposens has joined forces together with Infineon Technologies AG (FSE: IFNNY, OTCQX:) to develop 3D collision avoidance and obstacle detection in autonomous systems by using Toposens its proprietary 3D ultrasound technique. The Munich-based manufacturer of sensors provides 3D ultrasonic sensors called ECHO ONE DK that rely on the power of sound, machine-vision, and advanced algorithms to allow high-quality, cost-effective, and precise 3D vision for applications like autonomous driving, robotics and consumer electronic.

The simple-to-integrate 3D ultrasonic sensor allows for secure collision avoidance by using accurate 3D obstruction detection. It is based upon Infineon’s MEMS microphone XENSIV IM73A135V01. This next-generation reference device allows customers to decrease their time-to-market and development effort. It is also inexpensive and energy efficient in comparison to current manufacturing 3D devices. This new technology is perfect to improve the efficiency for automated vehicles (AGVs).

“Our XENSIV MEMS microphones enable the detection of sound pulses, so they are a critical component for 3D object localization via ultrasound,” said Dr. Roland Helm, Vice President and Head of Sensor Product Line from Infineon. “They offer a combination of exceptionally low noise and the highest SNR (signal-to-noise ratio) in the industry, resulting in improved reliability of the 3D data. This allows the detection of even the faintest ultrasonic echoes from distant, complex and small objects.”

“Making use of Infineon’s MEMS microphone, we were able to realize our new ultrasonic 3D sensor with a high overall sensitivity in the ultrasonic frequency spectrum, giving us the best range and widest opening angle,” said Tobias Bahnemann, CEO and co-founder of Toposens. “This enables our AGVs, robots or other applications to avoid collisions with all kinds of obstacles, even in the harshest environments, as proven by the IP57 protection rating.”

Typically the lighting conditions, reflections, and weather can affect the efficiency of current sensor technologies. Toposens sensors rely on echolocation for three-dimensional point cloud images in real time. These help autonomous systems navigate even the most difficult conditions , and lets consumer electronics recognize their surroundings. The ultrasonic echolocation sensor allows 3D multi-object detection. This is crucial for collision avoidance. It has minimal calibration effort, and with high reliability and durability. Furthermore, ultrasonic detection can reduce the number False positives, false negatives may be experienced when using optical sensors, and reduces the effectiveness that the device.

Toposens offers its customers the brand new platform ECHO One DK that allows for easy and flexible evaluation of the sensor within their products. To facilitate integration, CAN is offered as the standard communication interface and other options are available upon request. The three available software programs which include A C++ library, ROS support, and an open-platform 3D visualization of data. Additionally, an interface adapter is offered to allow firmware updates.

Michal Pukala
Electronics and Telecommunications engineer with Electro-energetics Master degree graduation. Lightning designer experienced engineer. Currently working in IT industry.