NewsMurata Introduces LBES5PL2EL and LBEE5PL2DL Modules for Next-Generation IoT Hardware with Matter...

Murata Introduces LBES5PL2EL and LBEE5PL2DL Modules for Next-Generation IoT Hardware with Matter Connectivity and LE Audio Functionality

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Murata, a leading manufacturer of electronic components, has recently launched a new wireless module that supports the latest MatterTM connectivity standard. The LBES5PL2EL module is designed to meet the increasing demands of next-generation IoT hardware, where having MatterTM connectivity is expected to become increasingly important.

This module is based on the highly-integrated IW612 single-chip 2.4/5GHz solution from NXP, which covers a broad array of different wireless protocols. It incorporates 1×1 dual-band Wi-FiTM (IEEE 802.11a/b/g/n/ac/ax), Bluetooth® 5.3, and IEEE 802.15.4, making it an ideal solution for a range of IoT applications.

MatterTM connectivity, previously known as Project CHIP, is a new open-source standard for smart home devices aimed at simplifying and unifying smart home connectivity standards. It is a collaboration between major tech companies, including Apple, Amazon, Google, and the Zigbee Alliance. The Matter standard provides a secure, reliable, and interoperable way for smart home devices to communicate with each other, regardless of their brand or ecosystem, by using IP-based connectivity.

The LBES5PL2EL module also includes LE Audio functionality, which is a significant advantage, especially in voice-controlled products. The latest generation of Bluetooth technology, including Bluetooth 5.3 and LE Audio, delivers improved audio performance, lower latency, and increased power efficiency, making it a more attractive solution for wireless audio applications.

The LBEE5PL2DL module is another product from Murata based on the NXP IW611 device, featuring both Wi-Fi 6 and Bluetooth 5.3 support. These modules are intended for a range of applications, including home automation equipment, digital assistants, smart domestic appliances, lighting gateways, climate control systems, and EV charging points.

Murata’s new wireless modules are supplied in compact surface-mount packages, with dimensions of just 8.8mm x 7.7mm x 1.3mm. FCC/IC and TELEC certification, as well as conductive tests for CE, are available, making it easier for customers to accelerate their time to market and keep product development costs down.

According to Akira Sasaki, Director of the Communication Module Division at Murata, the introduction of the LBES5PL2EL module will provide full support for Matter, including Thread, alongside Wi-Fi 6. This will be a real value to engineers developing hardware for home/building automation, as well as for numerous other purposes.

Michal Pukala
Electronics and Telecommunications engineer with Electro-energetics Master degree graduation. Lightning designer experienced engineer. Currently working in IT industry.